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1. Baahida Muhiimka ah ee ka timaadda Adeegayaasha AI iyo Xarumaha Xogta

Adeegayaasha AI waxay matalaan isha ugu weyn ee baahida sii kordheysamaro fiber galaas oo dielectric hooseeya. Tababarka AI iyo hababka go'aan qaadashada waxay ku tiirsan yihiin is-weydaarsiga xogta oo ballaaran, taasoo u baahan isticmaalka PCB-yada tirada sare leh iyo teknoolojiyada isku-xirka xawaaraha sare leh; tani waxay keenaysaa baahiyo aad u daran oo ku saabsan sifooyinka dielectric iyo xasilloonida cabbirka ee agabka. Iyadoo la qaadanayo teknoolojiyada sida PCIe 6.0 iyo modules-ka indhaha ee 224G, shuruudaha waxqabadka ee laminates-ka copper-clad (CCL) ee server-yada AI ayaa ka wareegay heerka hoose ee caadiga ah una wareegay heerarka aadka u hooseeya ee khasaaraha (ULL) iyo hyper-low-loss (HLL), taasoo si toos ah u horseedaysa koror ku yimid baahida loo qabo darajooyinka u dhigma ee maro fiber galaas oo dielectric ah oo hooseeya. Xogta suuqa ayaa tilmaamaysa in qiimaha CCLs ee server-yada AI uu yahay 5 ilaa 8 jeer ka badan server-yada dhaqameed. Iyada oo ah walxo ceeriin ah oo asaasi ah, maro fiber galaas oo dielectric ah oo heer sare ah ayaa qiimaheedu gaaray 320,000–350,000 RMB/ton sannadkii 2025 - koror 20% ah tan iyo bilowgii sanadka - iyadoo moodooyinka qaarkood ay la kulmayaan kor u kaca qiimaha ilaa 250%–300%.

Marka laga hadlayo farqiga baahida saadka, oo ay keentay baahida sii kordheysa ee macaamiisha AI ee hoose iyo xayiraadaha saaran awoodda wax soo saarka dharka elektaroonigga ah ee sare, heerarka kaydka badbaadada ee dharka elektaroonigga ah ee heerka sare ah ee soosaarayaasha waaweyn ee CCL ayaa hoos ugu dhacay wax ka yar hal toddobaad oo sahay ah, taasoo muujinaysa hoos u dhac taariikhi ah. Si loo daboolo baahida loo qabo alaabada heerka sare ah, soosaarayaasha CCL waxaa lagu qasbay inay kordhiyaan qiimaha wax iibsiga. Marka la eego isbeddellada qiimaha hadda jira iyo muuqaalka baahida saadka, maro galaas ah oo heer sare ah ayaa diyaar u ah inay aragto koror isku mar ah oo ku yimaada mugga iyo qiimaha labadaba.

2. Shuruudaha Waxqabadka ee Baakadaha Chip-ka ee Dhammaadka Sare

Tiknoolajiyadda baakadaha sare ee jajabyada AI waxay matalaysaa xaalad kale oo muhiim ah oo codsi ahmaro fiber galaas oo dielectric hooseeya. Iyadoo hababka wax soo saarka jajabku ay u gudbayaan noodhka 3nm iyo wixii ka dambeeya, cufnaanta baakadaha ayaa sii kordheysa. Substrates-ka ABF - sidayaasha muhiimka ah ee ku xiraya jajabyada PCBs - waxay ku soo rogaan shuruudo aad u adag sifooyinka dielectric iyo daahirnimada agabkooda saldhigga ah. Caadiyan, joogtada dielectric waa inay ku dhacdaa xadka 3.0–4.0 (1 MHz), iyadoo ku xiran inta jeer ee ay shaqeyneyso, halka qodobka kala firdhinta (Df) waa in la xakameeyaa inta u dhaxaysa 0.005 iyo 0.010 (1 MHz); codsiyada soo noqnoqda (sida 5G iyo isgaarsiinta xawaaraha sare) waxay u baahan karaan xitaa qiimayaal hoose (<0.005). Intaa waxaa dheer, si loo daboolo baahiyaha baakadaha cufnaanta sare leh, agabku waa inay dheellitiraan Coefficient hoose ee Ballaarinta Kulaylka (CTE) oo leh iska caabin kuleyl sare si looga hortago jabka wareegga oo ay keento cadaadiska kuleylka. Dharka faybarka Quartz (oo sidoo kale loo yaqaan "Q-dharka" ama "dharka elektaroonigga ah ee jiilka saddexaad") ayaa soo ifbaxay isagoo ah agabka ugu wanaagsan ee substrate-ka ABF sababtoo ah joogto dielectric hooseeya (2.2-2.3), luminta dielectric-ka ugu yar (Df ee 0.001-0.0005), iyo awoodda ay u adkeysan karto heerkulka hawlgalka muddada dheer ee 600°C ama ka sareeya.

Kobaca degdegga ah ee shixnadaha jajabka AI ee caalamiga ah ayaa si toos ah u horseedaya ballaarinta baahida dharka quartz. Sida laga soo xigtay saadaasha Future Think Tank, suuqa dharka quartz ee adduunka ayaa la filayaa inuu gaaro $3.127 bilyan marka la gaaro 2031, iyadoo heerka kobaca sanadlaha ah ee isku-dhafan (CAGR) uu yahay 23.30%. Saadaashani waxay hoosta ka xariiqaysaa isbeddelka kor u kaca ee baahida, kaas oo ku xiran kororka sii socda ee shixnadaha jajabka AI iyo qaadashada baahsan ee tignoolajiyada baakadaha horumarsan. Intaa waxaa dheer, horumarinta aaladaha AI ee jiilka soo socda - sida "Rubin" - waxay la jaanqaadaysaa hababka wax soo saarka jajabka 3nm ama N4 waxayna isticmaashaa baakadaha substrate-ka ee aadka u weyn ee CoWoS-L. Meelahani waxay isku daraan siddeed xirmo oo HBM4 ah si ay u daboolaan baahiyaha bandwidth sare iyo isku xirnaanta, iyagoo bixinaya xal ugu habboon oo lagu cabbirayo awoodda xisaabinta. Shuruudaha substrate-ka aadka u weyn iyo waxqabadka xad-dhaafka ah ayaa sii ballaarin doona baahida loo qabo walxaha ceeriin ee dharka quartz, taasoo horseedaysa horumarka dharka galaaska ee Low-Dk (joogtada dielectric hooseeya) ee xitaa heerarka dielectric hooseeya iyo astaamaha khasaaraha hoose.

3. Saamaynta Kobaca Wadajirka ah ee Qaybaha Badan

Marka laga soo tago qaybta ugu muhiimsan ee awoodda xisaabinta AI, baahida ka timaadda meelaha sida isgaarsiinta 5G/6G iyo qalabka elektaroonigga ah ee macaamiisha ee heerka sare ah ayaa horseedaya koboc isku-dhafan oo ay weheliso AI. Horumarka laga bilaabo 5G millimeter-mowjad (24-100 GHz) ilaa tiknoolajiyada terahertz 6G (qiyaastii 100 GHz-3 THz) waxay ku lug leedahay soo noqnoqosho sare oo ka dhigaysa qalabka isgaarsiinta mid aad u xasaasi u ah luminta calaamadaha. Iyadoo xilligii 5G uu u baahnaa dhar fiberglass ah oo aad u hooseeya, xilligii 6G wuxuu soo rogaa shuruudo xitaa adag oo loogu talagalay joogtada dielectric (Dk) iyo qodobka kala-baxa (Df): Dk waa inuu hoos ugu dhacaa 2.0-3.0 (>100 GHz), Df-na waa inuu ka yaraadaa heerka 5G ee 0.003-0.005 (10 GHz) ilaa 0.0001-0.0007 (100 GHz), taasoo abuuraysa baahi loo qabo dhar quartz ah oo "aad u hooseeya". Qaybta elektaroonigga macaamiisha, iPhone 17 waxay qaadatay CTE hooseeya (isku-darka ballaarinta kulaylka) iyo dharka dielectric hooseeya oo ay bixiso Honghe Technology si wax looga qabto caqabadaha sida alxamida chip-ka A10 Pro 3nm, ka hortagga qallooca ku jira motherboard-yada cufnaanta sare leh, iyo yaraynta luminta tamarta ee calaamadaha 5G/Wi-Fi 7 ee soo noqnoqda sare leh. Tallaabadani waxay muujinaysaa kala-guurka degdegga ah ee dharka elektaroonigga ah ee heerka sare ah laga bilaabo codsiyada warshadaha ilaa elektaroonigga macaamiisha ee caadiga ah, taasoo horseedaysa koror ku yimaada baahida agabka iyo kordhinta waqtiyada keenista keenista. Casriyeynta caqliga leh ee elektaroonigga baabuurta ayaa sidoo kale gacan ka geysanaysa baahida sii kordheysa; wadista madax-bannaan ee horumarsan (Heerka 3 iyo wixii ka sarreeya) waxay u baahan tahay dareemayaal badan oo ADAS ah iyo radar-rogado soo noqnoqda sare leh. Nidaamyadani waxay u baahan yihiin xasillooni gudbinta calaamadaha, isku-kalsoonida isku-dhafka alxanka muddada dheer, iyo adkeysiga heerka baabuurta ee ka dhanka ah gariirka, kulaylka, iyo qoyaanka. Sidaas darteed, agabka looxa wareegga oo leh joogtooyin dielectric hooseeya, lumis dielectric hooseeya, iska caabinta CAF (filament anodic conductive), iyo CTE hooseeya ayaa noqday doorashada la doorbiday ee nidaamyada wadista caqliga leh ee horumarsan, taasoo sii dardar gelinaysa qaadashada baahsan ee dharka fiberglass-ka heerka sare leh. Saadaasha warshaduhu waxay soo jeedinaysaa in suuqa caalamiga ah ee dharka elektaroonigga ah ee aan dielectric-ka lahayn uu gaari karo 3.76 bilyan oo yuan marka la gaaro 2031, isagoo ku koraya heer sannadeed isku dhafan oo ah 10.1% - isbeddel ay inta badan horseeddo isku-darka baahida qaybaha kala duwan.

Xuduudda ugu dambeysa ee ballaarinta awoodda xisaabinta waxay ku jirtaa jebinta xadka jireed ee agabka. Laga soo bilaabo PCB-yada aadka u hooseeya ee loo isticmaalo server-yada AI iyo dharka quartz ee baakadaha horumarsan ilaa laminates-ka heerka sare ah ee loogu talagalay elektiroonigga macaamiisha iyo wadista iskeed u shaqeysa, dharka fiberglass-ka ee hooseeya ee dielectric-ka ayaa galaya "waqti aan hore loo arag oo iftiiminaya." Iyada oo ay jirto muuqaal baahi sahay ah oo lagu garto mugga sii kordhaya, qiimaha sii kordhaya, iyo yaraanta awoodda, "dharka elektaroonigga ah" ee u muuqda mid fudud ayaa shaki la'aan soo ifbaxay isagoo ah mid ka mid ah qaybaha kobaca ugu qarxa ee isku xira kaabayaasha qalabka AI iyo teknoolojiyada isgaarsiinta ee soo noqnoqda sare ee jiilka soo socda.